SIPP (Single In-line Pin Package)

From Bauman National Library
This page was last modified on 24 December 2016, at 16:23.
Two SIPP memory modules
SIPP module beside empty SIMM holes on a motherboard

A SIPP (single in-line pin package) or SIP (single in-line package)[1] was a short-lived variant of the 30-pin SIMM random-access memory.

It consisted of a small printed circuit board upon which were mounted a number of memory chips. It had 30 pins along one edge which mated with matching holes in the motherboard of the computer.

SIP is not as common as the dual in-line package (DIP); however, SIPs have been used to package multiple resistors and RAM chips with a common pin. By either using surface mounting device process or DIP process, SIPs collectively arrange RAM chips on a small board. The board alone includes a single row of pin leads, which connect to a particular socket on a system or a system-expansion board. SIPs are usually associated with memory modules. When compared with DIPs, which have a typical maximum I/O count of 64, SIPs usually consist of a typical maximum I/O count of 24, but with lower package expenditures.[2]

Most small-form SIPs are parallel-array devices of common-value components, such as resistor arrays, diodes, etc. The large-form SIPs are often hybrid circuits, such as oscillators, timers, etc. The body of SIP is either made of ceramic or plastic, with a lead count usually ranging between four and 64. There are three SIP styles: molded, conformal coated and uncoated.

This type of memory was used in some 80286 and 80386 (80386SX) systems. It was soon replaced by SIMMs using edge connectors, which proved to be more economical and durable.

30-pin SIPP modules were pin compatible with 30-pin SIMM modules explaining why some SIPP modules were in fact SIMM modules with pins soldered onto the connectors.


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